Tabassum Yasmin, Muhammad Sadiq and Muhammad Imran Khan
Sn96.5Ag3Cu0.5 (SAC305) is widely used as lead-free solder for surface mount technology (SMT) card assembly and for ball-grid-array (BGA) interconnection in the microelectronic packaging industry as solder balls and pastes. In this study the effects of Lanthanum (La) doping on SAC305 under thermal aging was investigated as function of intermetallic compounds (IMCs) growth and grain size evolution. The morphology of the microstructure was analyzed under Scanning Electron Microscope (SEM) and optical microscope, the elemental distribution was confirmed by Energy Dispersive Spectroscopy (EDS) and phase identification of the crystalline structure formed during thermal aging was confirmed by x-ray diffraction (XRD). It was found that the microstructure of SAC305 solder alloy changes significantly with addition of La. Quantitative analysis of grain size and intermetallic particle size was performed both for undoped and La-doped SAC305 alloys.
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